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Customer Service Notes

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Micron's Customer Service Notes make doing business easier by offering detailed information about important standards and procedures.

File Title and Description sort Last Update sort
pdf CSN-24: Electrostatic Discharge (ESD) Precautions for the Handling and Assembly of Semiconductor Die and Wafers Oct 2006
pdf CSN-23: Proper Handling Procedures for Micron DRAM Modules - Includes procedures for how to properly handle modules Dec 2007
pdf CSN-22: Micron Known Good Die Definitions - Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. Jul 2008
pdf CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging May 2004
pdf CSN-20: Whole Wafer Packaging Mar 2008
pdf CSN-18: Design Considerations for Bare Die SiPs and MCMs Oct 2003
pdf CSN-17: Packaging Materials - Packaging specifications and materials descriptions Jun 2006
pdf CSN-16: Micron® Packaging - Explanation of Micron packaging labels and procedures Aug 2007
pdf CSN-15: Tape-and-Reel Procedures - Specifications for Micron’s tape-and-reel offerings Mar 2006
pdf CSN-12: Product Change Notification (PCN) System Jul 2005
pdf CSN-11: Product Mark/Label - Explains product part marking Jun 2008
pdf CSN-08: ISO System Management Standards Apr 2004
pdf CSN-07: Returned Material Authorization (RMA) Procedures - Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs Aug 2004
pdf CSN-06: Electronic Data Interchange - EDI transmission sets, protocol, and contacts Sep 2004
pdf CSN-04: Shipping Quantities and Weights - Provides tables of shipping weight per part quantity May 2008
pdf CSN-27: 300mm Back-Side Wafer ID - Describes the back-side scribe used on 300mm wafers Nov 2006